Copper Plating Corrosion Study in Certain Environments

Abstract

Copper plating was performed on nickel substrate by means of the potentiostatic electrodeposition method from a sulphate electrolyte solution. The copper coatings morphology was studied by means of the optical and electronic scanning microscopy techniques. The uniform electrodeposited films have a thickness of about 15 µm measured in cross-section. The corrosion behaviours of nickel substrate and copper films in different corrosive environments were studied. The corrosion study was performed by means of the linear polarisation method in four acid environments: 0.5 M H₂SO₄, HCl, HNO₃ and glacial CH₃COOH. From the recorded Tafel curves it was possible to obtain some information about the corrosion rate and the polarization resistance. In order to confirm these results, the gravimetric parameter was calculated by means of the “mass loss” method. By means of the X-ray diffraction analysis, the crystallographic structure of the specimens before and after corrosion was revealed. By means of the spectrophotometer device, the optical properties of the specimens were analysed.